Frore Systems Unveils Revolutionary AirJet Cooling for NVIDIA’s Jetson Orin Nano Super AI
Frore Systems has announced its latest innovation, the AirJet PAK 5C-25, a state-of-the-art cooling solution tailored for NVIDIA’s new Jetson Orin Nano Super AI "mini-supercomputer." This groundbreaking thermal module promises to maximize the performance of NVIDIA's AI-powered platform by tackling heat dissipation issues that could otherwise throttle its capabilities.
Unlocking Jetson Orin Nano Super’s Full Potential
The Jetson Orin Nano Super is NVIDIA’s latest AI computing powerhouse, capable of delivering up to 67 trillion operations per second (TOPS). It powers cutting-edge AI applications such as NVIDIA Isaac for robotics, NVIDIA Metropolis for vision AI, and NVIDIA Holoscan for sensor processing. However, the incredible performance potential of the 25W system-on-module (SoM) requires efficient cooling, especially for demanding edge computing use cases like industrial automation, healthcare analytics, and smart cities.
Frore Systems' AirJet PAK 5C-25 steps in to provide silent, dustproof, and water-resistant cooling, ensuring the Jetson Orin Nano Super can operate at its full 25W capacity. This is particularly vital in environments where reliability and compact form factors are key, and traditional fan-based cooling falls short.
The AirJet Advantage
Unlike bulky heat sinks or noisy fans, the AirJet PAK series leverages solid-state active cooling, a silent and ultra-compact solution that offers multiple advantages:
Dustproof and Water-Resistant Design: Increases durability and lifespan in harsh environments.
60% Smaller Form Factor: Dramatically reduces size compared to fan-based alternatives.
Silent Operation: No moving parts mean vibration-free performance.
Scalable Solutions: Multiple AirJet PAKs can be combined for higher heat dissipation and performance demands.
The flagship AirJet PAK 5C-25 supports up to 100 TOPS of AI performance while dissipating up to 25W of heat. Frore Systems also unveiled smaller variants:
AirJet PAK 3C-15: 15W heat dissipation, 40 TOPS support.
AirJet PAK 1C-5: 5W heat dissipation, 10 TOPS support.
Each module is engineered for plug-and-play integration with NVIDIA’s Jetson lineup and other SoMs from Qualcomm, AMD, and NXP.
AirJet at CES 2025
Frore Systems is set to showcase live demonstrations of the AirJet PAK technology at CES 2025, highlighting its applications across industrial platforms and consumer electronics. Visitors can witness its impact on products like the Samsung Galaxy Book4 Edge, MacBook Air, iPad Pro, and premium smartphones. These demonstrations will underline AirJet’s role in delivering enhanced performance in compact devices while maintaining optimal thermal management.
What do you think of this new solid-state cooling solution? Will this be a game-changer for edge AI and portable computing devices? Let us know your thoughts in the comments below!
