MediaTek Unveils Dimensity 9400+: A Refined 3nm Powerhouse Built on TSMC’s N3E Node With All-Performance Core Architecture
MediaTek has officially announced the Dimensity 9400+, a refined version of its flagship 3nm mobile chipset, building on the foundation of the original Dimensity 9400 with a modest performance uplift and advanced power efficiency. Fabricated using TSMC’s second-generation 3nm ‘N3E’ process, the Dimensity 9400+ exemplifies MediaTek’s commitment to performance and efficiency without reliance on low-power CPU cores—an industry-first configuration that continues to distinguish the company’s high-end silicon.
Elevated Architecture with All-Performance CPU Configuration
Staying true to its predecessor’s architectural philosophy, the Dimensity 9400+ embraces a full-performance core design, optimized for computational throughput:
1x ARM Cortex-X925 at 3.73GHz
3x ARM Cortex-X4 at 3.30GHz
4x ARM Cortex-A720 at 2.40GHz
This eight-core configuration is supported by a substantial 32MB cache system (12MB L3, 10MB system cache, and 10MB SLC), facilitating high concurrency and responsive performance across demanding mobile workloads. The absence of traditional efficiency cores is made possible by the power-saving benefits of the 3nm N3E node and MediaTek’s own Ultrasave 4.0 technology, which actively manages thermal and energy efficiency.
Enhanced Graphics and Multimedia Capabilities
Graphics rendering is handled by a 12-core ARM Immortalis-G720 GPU, supporting hardware-based ray tracing, enabling immersive visuals in supported mobile titles. In multimedia, the chipset supports:
Up to a single 320MP camera sensor
8K video recording at 60 frames per second
WQHD+ display resolution at 180Hz refresh rate
This positions the Dimensity 9400+ as a highly capable platform for premium imaging and display experiences.
AI and Connectivity: Built for the Next Generation
The SoC features the MediaTek 890 NPU, offering up to a 20% improvement in on-device AI performance compared to its predecessor. It supports generative AI, Agentic AI applications, and is natively compatible with DeepSeek’s R1 language model, opening new avenues for edge-based AI experiences.
Connectivity specifications include:
LPDDR5X RAM and UFS 4.0 storage support
Wi-Fi 7 tri-band (up to 7.3Gbps)
Bluetooth 6.0 (up to 12Mbps)
These features ensure compatibility with the latest networking and memory standards, enabling high-speed data transfers and low-latency application performance.
Iterative Refinement Ahead of Major Advancements
While the Dimensity 9400+ is a strategic enhancement over the standard 9400—offering improved CPU/GPU frequencies and better thermal scaling—it does not introduce architectural changes. The chip reinforces MediaTek’s iterative product cadence as the company prepares for the more significant architectural leap expected with the Dimensity 9500, scheduled for Q4 2025.
Smartphones featuring the Dimensity 9400+ are slated to arrive in the second quarter of 2025, targeting the premium Android segment.
What are your thoughts on MediaTek’s all-performance approach with the Dimensity 9400+? Do you see this architecture shaping future flagship devices? Join the conversation below.
