NVIDIA’s Next-Gen Rubin AI Architecture Reportedly Arriving by H2 2025, Poised to Disrupt Market Competition

NVIDIA’s upcoming Rubin AI architecture may arrive roughly six months earlier than planned, with trial production rumored to begin in H2 2025. According to a report from ZDNet Korea, key partner SK hynix is now on track to deliver HBM4 samples by June of next year, initiating mass production by Q3 2025. Initially, SK hynix intended to release HBM4 a quarter later, but accelerated development is said to stem from both market pressures and NVIDIA’s specific requests.

Early tape-out and verification of HBM4 for Team Green reportedly concluded in Q4 2024, granting NVIDIA exclusive early access to the next-gen memory standard. HBM4 is pivotal because it merges logic semiconductors and memory into a single package, reducing the need for extensive packaging steps. Featuring 24 Gb or 32 Gb dies at speeds of up to 6.4 Gbps, HBM4 offers a substantial improvement in both bandwidth and power efficiency.

Rubin Architecture Highlights
The Rubin AI architecture will reportedly use TSMC’s 3nm process and CoWoS-L packaging. Its primary focus is said to be superior performance-per-watt, addressing the rising energy demands of large-scale AI workloads. Observers speculate that if Rubin debuts in late 2025, NVIDIA could maintain its leadership in the AI segment, especially as competing solutions may arrive “several quarters” later.

How do you feel about NVIDIA’s accelerated timeline for Rubin and its partnership with SK hynix on HBM4? Share your thoughts in the comments below!