Apple Skips 2nm Fabrication for M5 Chip, Opts for TSMC's SoIC Tech; Mass Production Set for Late 2025
Apple's next-generation M5 chip, set to power future iPads, Macs, and potentially Apple's AI initiatives, will utilize TSMC's 3nm System-On-Integrated-Chip (SoIC) technology, bypassing the cutting-edge 2nm node due to high costs. Production is expected to begin in late 2025, with significant performance and efficiency upgrades promised over the M4 series.
The M5 chip will build on Apple's partnership with TSMC, using advanced 3D chip-stacking techniques under the SoIC framework. This design boosts thermal management and reduces power leakage, enhancing the chip's computational and graphical performance while maintaining efficiency.
Why Skip 2nm?
Cost concerns led Apple to stick with the 3nm process for now, extending its lifecycle while preparing for eventual 2nm adoption. Despite skipping the latest node, the M5 will surpass M4’s performance thanks to architectural enhancements and SoIC technology.
Timeline for Mass Production and Devices:
Mass Production: Begins H2 2025.
Expected Devices:
MacBook Pro: Likely the first to feature the M5 chip, possibly in late 2025.
MacBook Air: Expected in Spring 2026.
iPad Pro: May launch alongside the MacBook Pro or in 2026.
Apple Intelligence and AI Applications:
Apple plans to integrate M5 chips into its AI server infrastructure, potentially for projects like LLM Siri, a new AI-driven version of Siri slated for release in Spring 2026.
The M5 chip's advancements promise improved efficiency, better performance for AI workloads, and substantial upgrades across Apple’s product ecosystem, ensuring Apple remains at the forefront of the silicon race.
Do you think Apple’s choice to delay 2nm adoption is strategic or a missed opportunity? How do you see the M5 shaping the next wave of Apple devices? Let us know in the comments!
