SK hynix Demonstrates Unmatched AI Memory Innovations at NVIDIA GTC 2025

SK hynix has taken center stage at the NVIDIA GPU Technology Conference (GTC) 2025, showcasing industry-leading AI memory technologies from March 17–21 in San Jose, California. Under the theme “MEMORY, POWERING AI and TOMORROW,” SK hynix's exhibit emphasizes innovative solutions across artificial intelligence, data centers, automotive, and on-device applications.

The company's booth at GTC is divided into four dedicated sections: AI/Data Centers (DC), High Bandwidth Memory (HBM), On-Device, and Automotive, each highlighting advanced memory solutions designed to accelerate AI-driven innovation and performance.

Leading the Future with HBM4 and AI Solutions

One of the exhibition’s highlights is SK hynix’s cutting-edge HBM4 technology, unveiled globally for the first time at GTC 2025. HBM (High Bandwidth Memory) vertically stacks DRAM chips, delivering exceptional data transfer speeds significantly superior to traditional DRAM solutions. The newly introduced 12-layer HBM4, currently in development, promises groundbreaking enhancements in speed and energy efficiency, setting a new industry benchmark.

In addition to HBM4, SK hynix displayed the top-tier, high-capacity HBM3E memory, currently the best-performing HBM available, showcased alongside NVIDIA's GB200 Grace™ Blackwell Superchip.

Next-Level AI & Data Center Memory

In the AI and Data Centers section, SK hynix presents its latest enterprise SSDs (eSSDs) optimized for large-scale AI data processing, including PEB110, PS1010, and PEB9010, alongside robust DIMM solutions such as DDR5 RDIMM and MRDIMM. Additionally, the exhibit features the highest-spec graphics memory available today, GDDR7, and advanced next-gen products like the CMM-DDR5, a DDR5-based Compute Express Link (CXL) module, and the power-efficient, small form-factor SOCAMM, aimed at upcoming AI server markets.

Innovative Memory Solutions for On-Device Applications

The On-Device section highlights the latest memory innovations for mobile and embedded AI applications, such as the high-performance, power-efficient LPDDR6 and the compact LPCAMM2 module, offering comparable performance to dual DDR5 SODIMMs. Additionally, visitors can explore PCB01 and ZUFS 4.0, solutions optimized for efficient data management and high-speed operations on portable and mobile AI-driven devices.

Memory Advancements Driving Automotive Innovation

SK hynix's automotive showcase includes tailored solutions designed to meet the demanding requirements of autonomous driving technologies and advanced in-vehicle systems. Among these products are robust automotive-specific memory solutions, including HBM2E, LPDDR5, UFS 3.1, and advanced Gen4 SSDs, demonstrating the company's commitment to the rapidly evolving automotive memory landscape.

SK hynix Shares Industry Expertise

At GTC 2025, SK hynix also actively contributed to expert knowledge-sharing sessions. Technical Leader Jungsoo Park from HBM Product Planning delivered a compelling presentation titled “HBM: Backbone of High-Performance Computing and AI,” emphasizing SK hynix’s pioneering role in HBM technology evolution.

Additionally, Kihong Kim from SK hynix Mobility Business discussed “Preparing for the Future: Automotive Memory and Storage Requirements”, highlighting automotive industry trends and strategic solutions tailored to meet emerging automotive demands.

Virtual Experience and Future Commitments

Complementing the physical booth, SK hynix launched a virtual experience showcasing the company’s latest technological breakthroughs from 2024, such as server solutions, high-capacity SSD PS1012, GDDR7, and CMM-DDR5. Visitors can access informative videos about SK hynix's advanced products, reinforcing the company's dedication to technological leadership and innovation.

With AI technologies rapidly reshaping industries, SK hynix continues strengthening its collaborations with global technology leaders, committed to remaining at the forefront of AI memory innovation.

Explore further details about SK hynix’s participation at GTC 2025 in their official newsroom


What do you think about SK hynix’s cutting-edge memory innovations? Share your thoughts on how these advancements will impact AI and technology!

Angel Morales

Founder and lead writer at Duck-IT Tech News, and dedicated to delivering the latest news, reviews, and insights in the world of technology, gaming, and AI. With experience in the tech and business sectors, combining a deep passion for technology with a talent for clear and engaging writing

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